Rfic chip mounting structure
AssigneeMurata Manufacturing Co., Ltd.
InventorsKoji SHIROKI, Makoto OSAMURA, Takeshi KURIHARA, Masami MIZUYAMA
Life of this patent
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Abstract
An RFIC module includes an RFIC chip that is mounted on a mounting substrate and that is encapsulated with an encapsulation resin layer. The mounting substrate includes a flexible base and electrodes provided on the flexible base. External terminals are disposed near four corners of a mounting surface of the RFIC chip. One of a plurality of mounting lands located on the surface of the flexible base is a shared mounting land and defines an integrated mounting land that is shared by an RF terminal and an NC terminal of the RFIC chip. The shared mounting land is arranged to cover one side of the RFIC chip when viewed from above.
Claims4
A radio frequency integrated circuit chip mounting structure comprising:
- a radio frequency integrated circuit chip including a plurality of external terminals including a radio frequency terminal and an electrically independent terminal;
- and
- a mounting substrate including a flexible base and a plurality of mounting lands which are located on a surface of the flexible base, the plurality of external terminals of the radio frequency integrated circuit chip being connected to the plurality of mounting lands;
- at least one of the plurality of mounting lands being a shared mounting land to which the radio frequency terminal and the electrically independent terminal are connected in common;
- and
- the shared mounting land being arranged to cover at least one side of the radio frequency integrated circuit chip when viewed from above.
Dependencies are inferred from the claim text.