Semiconductor package for controlling warpage
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsMin-Shin Ou, Chun-Yang Lee, Jun Zhai
Life of this patent
Estimating the term…
Abstract
A semiconductor structure having a ring. The semiconductor structure includes a substrate, at least one chip, and the ring. The substrate has a first surface. The chip is located on the first surface of the substrate and electrically connected to the substrate. The ring has a first portion and a second portion. In various embodiments, the first and second portions different coefficients of thermal expansion (CTE), and or different cross-sectional widths. In another embodiment, the ring includes a third portion having a CTE different from both the first and second CTEs.
Claims20
A semiconductor structure having comprising:
- a substrate having a first surface;
- at least one chip located on the first surface of the substrate and electrically connected to the substrate;
- and
- a ring having a first portion and a second portion, the first portion being located on the first surface of the substrate and having a first coefficient of thermal expansion, the second portion being located on the first portion and having a second coefficient of thermal expansion, wherein a material of the second portion is different from a material of the first portion, and the second coefficient of thermal expansion is greater than the first coefficient of thermal expansion.
A semiconductor structure having comprising:
- a substrate having a first surface;
- at least one chip located on the first surface of the substrate and electrically connected to the substrate;
- and
- a ring having a first portion and a second portion, the first portion being located on the first surface of the substrate, the second portion being located on the first portion, a width of the first portion being less than a width of the second portion.
A semiconductor structure having comprising:
- a substrate having a first surface;
- at least one chip located on the first surface of the substrate and electrically connected to the substrate;
- and
- at least a bar having a first portion and a second portion, wherein the first portion having a first coefficient of thermal expansion is located on the first surface of the substrate and, the second portion having a second coefficient of thermal expansion is located on the first portion, and the second coefficient of thermal expansion is greater than the first coefficient of thermal expansion.
Dependencies are inferred from the claim text.