Semiconductor device
AssigneeSamsung Electronics Co., Ltd.
InventorsHo-Jin Lee, Sung-Dong Cho, Se-Young Jeong, Yeong-Lyeol Park, Sin-Woo Kang
Life of this patent
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Abstract
A semiconductor device may include a substrate and a through electrode. The substrate may have a first surface and a second surface opposite to the first surface, the substrate including circuit patterns formed on the first surface. The through electrode penetrates the substrate and may be electrically connected to the circuit pattern, the through electrode including a first plug that extends from the first surface in a thickness direction of the substrate and a second plug that extends from the second surface in the thickness direction of the substrate so as to be connected to the first plug.
Claims13
A semiconductor device, comprising:
- a substrate having a first surface and a second surface opposite to the first surface, the substrate including circuit patterns on the first surface;
- and
- a through electrode penetrating the substrate and electrically connected to the circuit patterns, the through electrode including a first plug and a second plug, the first plug extending from the first surface in a thickness direction of the substrate, the second plug extending from the second surface in the thickness direction of the substrate, the second plug connected to the first plug.
-15. (canceled)
A semiconductor device comprising:
- a substrate having a first surface and an opposing second surface;
- at least one circuit pattern on the first surface of the substrate;
- a first plug electrically connected to the at least one circuit pattern, the first plug extending from the first surface;
- and
- a second plug extending from the second surface, the second plug electrically connected to the first plug, the second plug having a width that is greater than that of the first plug.
Dependencies are inferred from the claim text.