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US 2012/0056315 A1Published application
Alignment Marks in Substrate Having Through-Substrate Via (TSV)
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsHsin Chang, Fang Wen Tsai, Jing-Cheng Lin, Wen-Chih Chiou, Shin-Puu Jeng
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Abstract
A device includes a substrate, and an alignment mark including a conductive through-substrate via (TSV) penetrating through the substrate.
Claims20
A device comprising:
- a substrate;
- and
- a first alignment mark comprising a first conductive through-substrate via (TSV) penetrating through the substrate.
A method of forming a device, the method comprising:
- providing a substrate;
- forming a first and a second conductive through-substrate via (TSV) in the substrate;
- and
- forming a conductive feature on a backside of the substrate and electrically coupled to the second conductive TSV by using the first conductive TSV as an alignment mark.
1 more element
Dependencies are inferred from the claim text.