Semiconductor Device and Method of Forming Base Leads from Base Substrate as Standoff for Stacking Semiconductor Die

A method of making a semiconductor device, comprising:

• providing a base substrate having first and second opposing surfaces;
• forming a first conductive layer over the first surface of the base substrate;
• forming a second conductive layer over the second surface of the base substrate;
• mounting a first semiconductor die to the first conductive layer over the base substrate;
• depositing an encapsulant over the first semiconductor die and base substrate;
• removing a portion of the base substrate to form electrically isolated base leads between opposing portions of the first conductive layer and second conductive layer;
• and
• mounting a second semiconductor die to the encapsulant and first conductive layer between the base leads.

A method of making a semiconductor device, comprising:

• providing a base substrate having first and second opposing surfaces;
• forming a first conductive layer over the first surface of the base substrate;
• forming a second conductive layer over the second surface of the base substrate;
• mounting a first semiconductor die to the first conductive layer over the base substrate;
• depositing an encapsulant over the first semiconductor die and base substrate;
• and
• removing a portion of the base substrate to form electrically isolated base leads between the first conductive layer and second conductive layer.

A semiconductor device, comprising:

• a base substrate having first and second opposing surfaces;
• a first conductive layer formed over the first surface of the base substrate;
• a second conductive layer formed over the second surface of the base substrate;
• a first semiconductor die mounted over the first conductive layer;
• an encapsulant deposited over the first semiconductor die and base substrate, wherein a portion of the base substrate is removed to form electrically isolated base leads between opposing portions of the first conductive layer and second conductive layer;
• and
• a second semiconductor die mounted over the encapsulant and first conductive layer between the base leads.