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US 2012/0056313 A1Published application
Semiconductor package
OwnerMasashi AIZAWA, Jun Morimoto +1inventors
InventorsMasashi AIZAWA, Jun Morimoto, Masayuki Kato
Life of this patent
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Abstract
A semiconductor package includes a radiator plate including a stress alleviation section, a resin sheet arranged on the radiator plate, a pair of bus bars joined to the radiator plate through the resin sheet at positions at which the stress alleviation section is interposed between the bus bars, and a semiconductor device joined to the pair of bus bars by being sandwiched between the bus bars, and energized from outside through the pair of bus bars.
Claims7
A semiconductor package comprising:
- a radiator plate including a stress alleviation section;
- a resin sheet arranged on the radiator plate;
- a pair of bus bars joined to the radiator plate through the resin sheet at positions at which the stress alleviation section is interposed between the bus bars;
- and
- a semiconductor device joined to the pair of bus bars by being sandwiched between the bus bars, and energized from outside through the pair of bus bars.
2 more elements
A semiconductor package comprising:
- a radiator plate;
- a resin sheet arranged on the radiator plate;
- a pair of bus bars joined to the radiator plate through the resin sheet, and provided with stress diversification sections on a surface on which the bus bars are in contact with the resin sheet;
- and
- a semiconductor device joined to the pair of bus bars by being sandwiched between the bus bars, and energized from outside through the pair of bus bars.
2 more elements
Dependencies are inferred from the claim text.