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US 2012/0056296 A1Published application
Semiconductor device and method of blowing fuse thereof
AssigneeRenesas Electronics Corporation
InventorHiroyuki FURUKAWA
Life of this patent
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Abstract
A semiconductor device comprises an active region including a core circuit forming region and a buffer forming region, and a fuse element forming region arranged on a corner of the active region and to be able to be electrically fused. It is possible to arrange the fuse element without forming the fuse in the core circuit forming region by arranging the fuse element forming region at the corner of the active region.
Claims2
A semiconductor device comprising:
- an active region including a core circuit forming region and a buffer forming region;
- a fuse element forming region arranged on a corner of the active region and to be able to be electrically fused;
- and
- a pad forming region to be arranged around the buffer forming region,
- wherein the fuse element is coupled to a first pad and a second pad in the pad forming region,
- the first pad is opened to an external terminal, and
- the second pad is bonded to the external terminal.
4 more elements
Dependencies are inferred from the claim text.