Semiconductor package and manufacturing method for a semiconductor package as well as optical module

A manufacturing method for a semiconductor package, comprising:

• laminating a sealing substrate to a supporting substrate having a first principal surface on which a functioning element and a first joining element are provided;
• forming a through-electrode in a region of the supporting substrate which corresponds to the first joining element;
• forming a second joining element electrically connected to the through-electrode on a second principal surface side of the supporting substrate;
• and
• spreading a conductive material to an overall area of a side face of the first supporting substrate which extends perpendicularly to the first and second principal surfaces to form a first electromagnetic shield film.

An optical module, comprising:

• a supporting substrate;
• a light reception element and a first joining element formed on a first principal surface of said supporting substrate;
• a sealing substrate disposed in an opposing relationship to said supporting substrate with said light reception element and said first joining element interposed therebetween;
• a second joining element provided on a second principal surface of said supporting substrate;
• a through-electrode provided in and extending through said supporting substrate and adapted to electrically connect said first and second joining elements;
• a lens unit provided on said sealing substrate;
• and
• a first electromagnetic shield film coated in an overall area of a side face of said supporting substrate which extends perpendicularly to said first and second principal surfaces.