Semiconductor device, manufacturing method therefor, and electronic apparatus

A method of manufacturing a semiconductor device comprising:

• stacking a second semiconductor chip on a first semiconductor chip;
• exposing a side surface of a first wiring portion, which is formed on the first semiconductor chip, and a side surface of a second wiring portion, which is formed on the second semiconductor chip, at a side portion of a stacked body in which the first semiconductor chip and the second semiconductor chip are stacked;
• and
• electrically connecting the first wiring portion and the second wiring portion to each other by providing a conductive layer so as to cover the side surfaces of the first wiring portion and the second wiring portion which are exposed at side portions of the first semiconductor chip and the second semiconductor chip.

An electronic apparatus comprising:

• a first semiconductor chip;
• and
• a second semiconductor chip that is stacked on the first semiconductor chip,
• wherein the first semiconductor chip includes a first wiring portion of which a side surface is exposed at a side portion of the first semiconductor chip,
• wherein the second semiconductor chip includes a second wiring portion of which a side surface is exposed at a side portion of the second semiconductor chip, and
• wherein the respective side surfaces of the first wiring portion and the second wiring portion, which are exposed at the side portions of the first semiconductor chip and the second semiconductor chip, are covered by a conductive layer, and the first wiring portion and the second wiring portion are electrically connected to each other through the conductive layer.