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US 2012/0056280 A1Published application
MEMS Sensor Package
OwnerMing-Ching WU, Chih-Kung Huanginventors
Life of this patent
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Abstract
A MEMS sensor package includes a support and a MEMS sensor chip having a mounting side adhered on the support by a point-shaped adhesive or a linear-shaped adhesive in such a way that the MEMS sensor chip has a free side opposite to the mounting and suspended above the support. Because the MEMS sensor chip has the free side that is not restrained on the support, the stress due to deformation of the support will not affect the accuracy of the MEMS sensor chip.
Claims19
A MEMS sensor package, comprising:
- a support;
- and
- a MEMS sensor chip adhered on the support and having a free side suspended above the support.
Dependencies are inferred from the claim text.