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AssigneesPromerus, LLC, Merck Patent GmbH
InventorsDavid Christoph Mueller, Pawel Miskiewicz, Toby Cull, Piotr Wierzchowiec, Andrew Bell, Edmund Elce, Larry F. Rhodes, Kazuyoshi Fujita, Hendra Ng, Pramod Kandanarachchi, Steven Smith
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Embodiments in accordance with the present invention provide for the use of polycycloolefins in electronic devices and more specifically to the use of such polycycloolefins as interlayers applied to fluoropolymer layers used in the fabrication of electronic devices, the electronic devices that encompass such polycycloolefin interlayers and processes for preparing such polycycloolefin interlayers and electronic devices.
An interlayer that is in contact with a dielectric layer in an electronic device, said interlayer comprising a polycycloolefinic polymer, or a polymer composition comprising a polycycloolefinic polymer.
An electronic device comprising an interlayer that is in contact with a dielectric layer, said interlayer comprising a polycycloolefinic polymer or a polymer composition comprising a polycycloolefinic polymer.
A polycycloolefinic polymer, or a polymer composition comprising a polycycloolefinic polymer, for forming an interlayer that is in contact with a dielectric layer in an organic electronic device.
A polymer composition comprising a polycycloolefinic polymer that contains one or more repeating units having a crosslinkable group, and further comprising an adhesion promoter which is a compound comprising a surface-active functional group and a crosslinkable functional group that is capable of reacting with the said crosslinkable group of the repeating unit of the polymer or polymer composition.
Dependencies are inferred from the claim text.