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US 2012/0056234 A1Published application
Heat dissipation material and light emitting diode package including a junction part made of the heat dissipation material
AssigneeSamsung Electronics Co., Ltd.
InventorsEun Sung Lee, Sang Soo Jee, Kun Mo Chu, Se Yun Kim, Kyu Hyoung Lee, Sang Mock Lee
Life of this patent
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Abstract
Disclosed are a heat dissipation material comprising a metallic glass and an organic vehicle and a light emitting diode package including at least one of a junction part, wherein the junction part includes a heat dissipation material including a metallic glass.
Claims16
A heat dissipation material comprising a metallic glass and an organic vehicle.
A light emitting diode package comprising at least one of a junction part, wherein the junction part comprises a heat dissipation material comprising a metallic glass.
Dependencies are inferred from the claim text.