Led package
AssigneeAdvanced Optoelectronic Technology, Inc.
InventorsTZU-CHIEN HUNG, CHIA-HUI SHEN
Life of this patent
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Abstract
An LED package includes a base, an LED chip and an encapsulation. The LED chip is mounted on the base. The encapsulation encapsulates the LED chip. A heat dissipating plate is sandwiched between the LED chip and the base. The heat dissipating plate includes a first surface and a second surface. The LED chip is mounted on the first surface of the heat dissipating plate and has an interface engaging with the first surface of the heat dissipating plate. The first surface of the heat dissipating plate has an area greater than that of the interface. The second surface of the heat dissipating plate is attached to the base.
Claims10
An LED package comprising:
- a base;
- a heat dissipating plate mounted on the base, the heat dissipating plate comprising a first surface and a second surface, the second surface attached to the base, the first surface being opposite to the second surface;
- an LED chip mounted on the first surface of the heat dissipating plate, the heat dissipating plate being located between the base and the LED chip, the LED chip having an interface attached to the first surface of the heat dissipating plate, the first surface of the heat dissipating plate having an area greater than that of the interface of the LED chip.
Dependencies are inferred from the claim text.