Led chip modules, method for packaging the led chip modules, and moving fixture thereof

A moving fixture, suitable for moving multiple LED chips synchronously, said moving fixture comprising:

• an upper molding board having a vacuum chamber;
• a lower molding board having multiple through-holes, wherein said through-holes pass through a body of said lower molding board and communicate with said vacuum chamber;
• and
• a carrying disc having multiple accommodating locations, into which said LED chips are placed, wherein said LED chips placed in said carrying disc are adapted to be sucked synchronously by said moving fixture using vacuum suction.

An LED chip module, comprising:

• at least one LED chip having a substrate and a plurality of epitaxial layers;
• an optical cup having a inside bottom and an upper edge, said optical cup carrying at least one LED chip via said inside bottom;
• said upper edge of said optical cup including at least one enclosed groove or at least one enclosed flange surrounding said at least one LED chip;
• at least one insulating layer located on said enclosed groove or said enclosed flange;
• two conductive layers located on said insulating layer;
• two wires, each connected between said corresponding conductive layer and said at least one LED chip;
• and
• an encapsulation structure covering said at least one LED chip, wherein the range formed with said encapsulation structure is restricted by said enclosed groove or said enclosed flange, and each of said two wires extends outside of said encapsulation structure via said corresponding conductive layer.