Light emitting diode package and manufacturing method thereof

A method of fabricating a light emitting diode (LED) package, comprising:

• forming a lead frame comprising a thermal pad and at least two electrode pads disposed at a distance from the thermal pad;
• forming a package mold by injection molding, the package mold comprising a first cavity to receive in the cavity the thermal pad and the at least two electrode pads, and to partially expose the thermal pad and the at least two electrode pads through a first surface of the package mold, and exposing the thermal pad and the at least two electrode pads through a surface coplanar with a second surface opposite to the first surface;
• mounting at least one LED on the thermal pad exposed through the first cavity;
• wire-bonding the at least one LED to the at least two electrode pads so the at least one LED and the at least two electrode pads are electrically connected to each other;
• and
• filling an inside of the first cavity with a molding material.