Led package structure and packaging method thereof

A LED package structure, comprising:

• a supporting substrate having a top surface and a bottom surface, wherein said supporting substrate comprises a first channel and a concave structure;
• at least one first electrically-conductive structure filled in said first channel and partially formed on said top surface and said bottom surface of said supporting substrate;
• a LED chip accommodated within said concave structure;
• an insulating layer formed over said supporting substrate and said LED chip and having at least two second channels, wherein said second channels are corresponding to an electrode of said LED chip and said first electrically-conductive structure, respectively;
• and
• at least one second electrically-conductive structure filled in said second channels and partially formed on said insulating layer, and connected with said electrode of said LED chip and said first electrically-conductive structure, wherein said LED chip and said top surface and said bottom surface of said supporting substrate are electrically connected with each other through said first electrically-conductive structure and said second electrically-conductive structure.

A LED packaging method, comprising steps of:

• providing a supporting substrate comprising a top surface and a bottom surface;
• forming at least one first channel in said supporting substrate;
• forming at least one first electrically-conductive structure in said first channel and partially on said top surface and said bottom surface of said supporting substrate so as to electrically connect said top surface and said bottom surface of said supporting substrate;
• disposing a LED chip over said supporting substrate;
• forming an insulating layer over said supporting substrate and on bilateral sides of said LED chip, wherein said insulating layer has at least one second channel corresponding to said first electrically-conductive structure;
• and
• forming at least one second electrically-conductive structure in said second channel and partially on said insulating layer so as to connect with an electrode of said LED chip, wherein said LED chip and said top surface of said supporting substrate are electrically connected with each other through said second electrically-conductive structure.

A LED packaging method, comprising steps of:

• providing a supporting substrate comprising a top surface and a bottom surface;
• forming at least one first channel and a concave structure in said supporting substrate;
• forming at least one first electrically-conductive structure in said first channel and partially on said top surface and said bottom surface of said supporting substrate so as to electrically connect said top surface and said bottom surface of said supporting substrate;
• disposing a LED chip within said concave structure of said supporting substrate;
• forming an insulating layer over said supporting substrate and said LED chip and forming at least two second channels in said insulating layer, wherein each said second channel is corresponding to an electrode of said LED chip and said first electrically-conductive structure;
• and
• forming at least one second electrically-conductive structure in said second channels and partially on said insulating layer so as to connect with said electrode of said LED chip and said first electrically-conductive structure.