Light emitting diode package

A light emitting diode package comprising a package body and a light emitting diode chip mounted on the package body,

• wherein the package body comprises:
• an upper dielectric substrate comprising a plurality of upper conductive patterns disposed on an upper surface of the upper dielectric substrate;
• a lower dielectric substrate comprising a plurality of lower conductive patterns disposed on a lower surface of the lower dielectric substrate;
• a plurality of middle conductive patterns interposed between the upper and lower dielectric substrates;
• upper vias disposed in the upper dielectric substrate to connect the upper conductive patterns to the middle conductive patterns therethrough, respectively;
• and
• lower vias disposed in the lower dielectric substrate to connect the middle conductive patterns to the lower conductive patterns therethrough, respectively.

A light emitting diode package comprising a package body and a light emitting diode chip mounted on the package body,

• wherein the package body comprises:
• a plurality of upper conductive patterns formed on an upper surface of a dielectric substrate by metal plating and electrically connected to the light emitting diode chip by die attaching or wire bonding;
• a plurality of lower conductive patterns formed on a lower surface of the dielectric substrate by metal plating;
• conductive materials extending from the respective upper conductive patterns to the respective lower conductive patterns through an interior of the dielectric substrate;
• and
• a heat sink pattern formed on the lower surface of the dielectric substrate by metal plating and electrically separated from the upper conductive patterns.

A light emitting diode package comprising:

• a package body comprising a first ceramic substrate comprising conductive patterns including a landing pad formed thereon and at least one second ceramic substrate disposed below the first ceramic substrate;
• a light emitting diode chip mounted on the landing pad;
• and
• lead electrodes connected to at least some of the conductive patterns while extending to a lower surface of the package body through a side surface of the package body.