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US 2012/0056215 A1Published application
Led package having an array of light emitting cells coupled in series
AssigneeSeoul Semiconductor Co., Ltd.
InventorsChung Hoon LEE, Keon Young LEE, Hong San KIM, Dae Won KIM, Hyuck Jung CHOI
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Abstract
Disclosed is a light emitting diode (LED) package having an array of light emitting cells coupled in series. The LED package comprises a package body and an LED chip mounted on the package body. The LED chip has an array of light emitting cells coupled in series. Since the LED chip having the array of light emitting cells coupled in series is mounted on the LED package, it can be driven directly using an AC power source.
Claims17
A light-emitting diode package, comprising:
- a heat sink;
- a package body coupled with the heat sink, the package body exposing a bottom surface of the heat sink;
- a light-emitting chip arranged on the heat sink;
- a first lead frame electrically connected to the heat sink, the first lead frame comprising:
- a first inner lead frame disposed inside the package body;
- and
- a first outer lead frame coupled with the first inner lead frame, the first outer lead frame protruding from the package body and comprising a first bent portion;
- a second lead frame separated from the heat sink, the second lead frame comprising:
- a second inner lead frame disposed inside the package body;
- and
- a second outer lead frame coupled with the second inner lead frame, the second outer lead frame protruding from the package body and comprising a second bent portion,
- wherein the first inner lead is arranged around a portion of the heat sink on which the light-emitting chip is arranged.
9 more elements
A light-emitting diode package, comprising:
- a heat sink;
- a package body coupled with the heat sink;
- a light-emitting chip arranged on the heat sink;
- a first lead frame electrically connected to the heat sink, the first lead frame comprising:
- a first inner lead frame disposed inside the package body;
- and
- a first outer lead frame coupled with the first inner lead frame, the first outer lead frame protruding from the package body;
- a second lead frame separated from the heat sink, the second lead frame comprising:
- a second inner lead frame disposed inside the package body;
- and
- a second outer lead frame coupled with the second inner lead frame, the second outer lead frame protruding from the package body,
- wherein the package body exposes a bottom surface of the heat sink, the first outer lead frame comprises a first bent portion, and the second outer lead frame comprises a second bent portion, and
- wherein the bottom surface of the heat sink, the first bent portion of the first outer lead frame, and the second bent portion of the second outer lead frame are aligned for mounting on a substantially flat surface.
10 more elements
Dependencies are inferred from the claim text.