Semiconductor device and method for fabricating the same
AssigneeKabushiki Kaisha Toshiba
InventorsChiharu OTA, Hiroshi Kono, Kazuto Takao, Takashi Shinohe
Life of this patent
Estimating the term…
Loading patent…
AssigneeKabushiki Kaisha Toshiba
InventorsChiharu OTA, Hiroshi Kono, Kazuto Takao, Takashi Shinohe
Estimating the term…
A semiconductor device according to an embodiment includes a semiconductor substrate of a first conductivity type, a first semiconductor layer of the first conductivity type, a first semiconductor region of a second conductivity type, a second semiconductor region of the second conductivity type, a first electrode and a second electrode. The first semiconductor region is formed on at least a part of the first semiconductor layer formed on the semiconductor substrate. The second semiconductor region is formed on another part of the first semiconductor layer to reach an inside of the first semiconductor layer and having an impurity concentration higher than that of the first semiconductor region. The first electrode is formed on the second semiconductor region and a third semiconductor regions formed in a part of the first semiconductor region. The second electrode is formed to be in contact with a rear surface of the semiconductor substrate.
A semiconductor device comprising:
A method for fabricating a semiconductor device comprising:
Dependencies are inferred from the claim text.