Method of manufacturing electronic element and electronic element
AssigneeSony Corporation
InventorsMasanao Kamata, Hiroaki Yamana, Iwao Yagi, Noriyuki Kawashima
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Abstract
There is provided a method of manufacturing an electronic element for forming the electronic element including one or more wiring layers and an organic insulating layer stacked on a substrate. The method includes a wiring layer formation step of forming the wiring layer on the substrate; an organic insulating layer formation step of forming an organic insulating layer on the wiring layer; and an irradiation step of irradiating a short-circuit portion of the wiring layer through the organic insulating layer with a laser beam having a wavelength transmissive through the organic insulating layer.
Claims17
A method of manufacturing an electronic element for forming the electronic element including one or more wiring layers and an organic insulating layer stacked on a substrate, the method comprising:
- a wiring layer formation step of forming the wiring layer on the substrate;
- an organic insulating layer formation step of forming an organic insulating layer on the wiring layer;
- and
- an irradiation step of irradiating a short-circuit portion of the wiring layer through the organic insulating layer with a laser beam having a wavelength transmissive through the organic insulating layer.
A method of manufacturing an electronic element for forming the electronic element including one or more wiring layer and an organic insulating layer stacked on a substrate, the method comprising:
- a wiring layer formation step of forming the wiring layer on the substrate;
- an organic insulating layer formation step of forming an organic insulating layer on the wiring layer;
- and
- an irradiation step of irradiating a short-circuit portion of the wiring layer through the substrate with a laser beam having a wavelength transmissive through the substrate.
An electronic element comprising:
- one or more wiring layers and an organic insulating layer stacked together on a substrate;
- and
- a cavity enclosed by the wiring layer and the organic insulating layer or the substrate in contact with a top or bottom of the wiring layer, the cavity being provided in the same layer as the wiring layer.
Dependencies are inferred from the claim text.