Multi-chip packages
AssigneeSamsung Electronics Co., Ltd.
InventorsWon-Gil Han, Seung-Weon Ha, Yong-Je Lee, Han-Ki Park
Life of this patent
Estimating the term…
Abstract
A multi-chip package may include a package substrate, a plurality of semiconductor chips and conductive connecting members. The semiconductor chips may be sequentially stacked on the package substrate. Each of the semiconductor chips may include a signal pad and a test pad. The conductive wires may be electrically connected between the signal pad of an upper semiconductor chip among the semiconductor chips and the package substrate via the test pad of a lower semiconductor chip under the upper semiconductor chip. The test pad may be converted into the dummy pad by cutting a fuse.
Claims16
A multi-chip package, comprising:
- a substrate;
- a plurality of semiconductor chips stacked on a first surface of the substrate, each of the semiconductor chips including a signal pad and a test pad;
- and
- a conductive connecting member electrically connected to the signal pad of a first semiconductor chip of the plurality of semiconductor chips, the substrate, and the test pad of a second semiconductor chip of the plurality of semiconductor chips, the second semiconductor chip between the first semiconductor chip and the substrate.
10-14. (canceled)
A multi-chip package, comprising:
- a substrate including a first circuit;
- and
- a first semiconductor chip including a first signal pad and a first test pad, the first test pad conductively connected to the first circuit.
Dependencies are inferred from the claim text.