Semiconductor light emitting device and method for manufacturing same
AssigneeKabushiki Kaisha Toshiba
InventorsToshiki Hikosaka, Koichi Tachibana, Hajime Nago, Shinya Nunoue
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AssigneeKabushiki Kaisha Toshiba
InventorsToshiki Hikosaka, Koichi Tachibana, Hajime Nago, Shinya Nunoue
Estimating the term…
According to one embodiment, a semiconductor light emitting device includes an n-type layer, a p-type layer, and a light emitting unit provided between the n-type layer and the p-type layer and including barrier layers and well layers. At least one of the barrier layers includes first and second portion layers. The first portion layer is disposed on a side of the n-type layer. The second portion layer is disposed on a side of the p-type layer, and contains n-type impurity with a concentration higher than that in the first portion layer. At least one of the well layers includes third and fourth portion layers. The third portion layer is disposed on a side of the n-type layer. The fourth portion layer is disposed on a side of the p-type layer, and contains n-type impurity with a concentration higher than that in the third portion layer.
A semiconductor light emitting device comprising:
A method for manufacturing a semiconductor light emitting device, the device including:
Dependencies are inferred from the claim text.