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US 2012/0055940 A1Published application
Enclosure of electronic device
AssigneeHon Hai Precision Industry Co., Ltd.
InventorYAO-TING CHANG
Life of this patent
Estimating the term…
Abstract
An enclosure of an electronic device includes a bottom wall and a sidewall. The sidewall includes at least two non-coplanar portions. Each of the non-coplanar portions defines a plurality of through holes for heat dissipation.
Claims4
An enclosure comprising:
- a bottom wall;
- and
- a sidewall extending from the bottom wall and comprising at least two non-coplanar portions, wherein each of the at least two non-coplanar portions defines a plurality of through holes for heat dissipation.
Dependencies are inferred from the claim text.