Method and system for thermal treatment of substrates
AssigneeSokudo Co., Ltd.
InventorsLeon Volfovski, Harald Herchen, Jay D. Pinson
Life of this patent
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Abstract
A rapid temperature change (RTC) system includes a bake plate assembly including a heat spreader; a heater substrate coupled to the heat spreader; and a heater layer coupled to the heater substrate. The RTC system also includes a passive chill structure positioned adjacent the bake plate assembly. The passive chill structure is moveable to make physical contact with the heater layer. The passive chill structure includes a chill plate and a thermal pad coupled to the chill plate. The RTC system further includes an active chill structure positioned adjacent the passive chill structure. The passive chill structure is moveable to make physical contact with the active chill structure.
Claims12
A rapid temperature change (RTC) system comprising:
- a bake plate assembly comprising:
- a heat spreader;
- a heater substrate coupled to the heat spreader;
- and
- a heater layer coupled to the heater substrate;
- a passive chill structure positioned adjacent the bake plate assembly, wherein the passive chill structure is moveable to make physical contact with the heater layer, the passive chill structure comprising:
- a chill plate;
- and
- a thermal pad coupled to the chill plate;
- and
- an active chill structure positioned adjacent the passive chill structure, wherein the passive chill structure is moveable to make physical contact with the active chill structure.
Dependencies are inferred from the claim text.