Substrate fabricating apparatus and substrate fabricating method

Abstract

Disclosed herein are a substrate fabricating apparatus and a substrate fabricating method. The substrate fabricating apparatus includes: a first injector that injects a first etchant to a circuit layer formed as an outermost layer of a base substrate to form first type of ruggedness; and a second injector that injects a second etchant to the circuit layer formed with the first type of ruggedness to form second type of ruggedness. The present invention provides the substrate fabricating apparatus and the substrate fabricating method that inject different etchants to the circuit layer to form different ruggedness, thereby making it possible to widen the specific surface area of the circuit layer to improve adhesion between the circuit layer and the protective layer.

Dependencies are inferred from the claim text.