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US 2012/0055802 A1Published application
Acidic gold alloy plating solution
AssigneeRohm and Haas Electronic Materials LLC
InventorsYutaka MORII, Masanori Orihashi
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Abstract
A gold alloy plating solution and plating method thereof that provides a gold plating solution with high deposition selectivity by using a gold plating solution that contains gold cyanide, cobalt ions, hexamethylene tetramine, and specific glossing agents.
Claims10
1:
- An acidic gold alloy plating solution containing gold cyanide or salt thereof, cobalt ions, chelating agent, hexamethylene tetramine, and one or more pyridine carboxylic acids and at least one compound selected from the group consisting of alkanolamines, dialkanolamines, trialkanolamines, amino acids and thiocarboxylic acids.
(canceled)
3:
- The acidic gold alloy plating solution according to claim 1, wherein the pH of the plating solution is in a range between 3 and 6.
4:
- The acidic gold alloy plating solution according to claim 1, wherein the chelating agent is a compound containing a carboxyl group.
5:
- A method of forming a gold alloy plating film by electrolytic plating comprising a) providing an acidic gold alloy plating solution containing gold cyanide or salt thereof, cobalt ions, chelating agent, hexamethylene tetramine, one or more pyridine carboxylic acids and at least one compound selected from the group consisting of alkanolamines, dialkanolamines, trialkanolamines, amino acids and thiocarboxylic acids;
- and b) electroplating the gold alloy film onto an electronic component.
6:
- The method according to claim 5, wherein the pH of the plating solution is in a range between 3 and 6.
7:
- A method of manufacturing a connector formed with a gold alloy plating film, comprising:
- a) performing nickel plating on the contact region of the connector;
- and b) performing gold alloy plating on the nickel;
- wherein said gold alloy plating is electrolytic plating using an acidic gold alloy plating solution comprising gold cyanide or salt thereof, cobalt ions, chelating agent, hexamethylene tetramine, one or more pyridine carboxylic acids and at least one compound selected from the group consisting of alkanolamines, dialkanolamines, trialkanolamines, amino acids and thiocarboxylic acids.
1 more element
8:
- The acidic gold alloy plating solution according to claim 1, wherein the hexamethylene tetramine is between 0.05 g/L and 10 g/L.
9:
- The method of claim 7, wherein the current density is from 0.1 A/dm2 to 80 A/dm2.
10:
- The method of claim 9, wherein the current density is from 10 A/dm2 to 70 A/dm2.
Dependencies are inferred from the claim text.