Gallium Electrodeposition Processes and Chemistries
AssigneeInternational Business Machines Corporation
InventorsShafaat Ahmed, Hariklia Deligianni
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Abstract
Solutions and processes for electrodepositing gallium or gallium alloys includes a plating bath free of complexing agents including a gallium salt, an indium salt, a combination thereof, and a combination of any of the preceding salts with copper, an acid, and a solvent, wherein the pH of the solution is in a range selected from the group consisting of from about zero to about 2.6 and greater than about 12.6 to about 14. An optional metalloid may be included in the solution.
Claims19
A solution for electrodeposition of a thin film, the solution comprising:
- a metal salt, wherein the metal is selected from the group consisting of gallium, indium, a combination thereof, and a combination of any of the preceding with copper;
- an acid selected from the group consisting of an alkane acid, an alkene acid, an aryl acid, a heterocyclic, an aromatic sulfonic acid, an aromatic sulfuric acid, hydrochloric acid, perchloric acid, and nitric acid;
- optionally a metalloid compound wherein the metalloid compound is selected from the group consisting of arsenic, antimony, bismuth, a combination thereof;
- and
- a solvent to dissolve said metal salt,
- wherein the pH of the solution is in a range selected from the group consisting of from about zero to about 2.6 and greater than about 12.6 to about 14, and wherein the solution is free of a complexing agent.
A method for electrodepositing a substrate, the method comprising:
- contacting (i) a solution comprising a metal salt, wherein the metal is selected from the group consisting of gallium, indium, a combination thereof, and a combination of any of the preceding with copper;
- optionally an inorganic metalloid compound;
- further optionally an organic additive having at least one sulfur atom;
- and a solvent to dissolve said metal salt, wherein the solution is free of a complexing agent;
- and (ii) a substrate;
- adjusting pH of the solution to a range selected from the group consisting of from about zero to about 2.6 and greater than about 12.6 to about 14;
- and
- applying a current to electroplate the substrate with a metal containing film.
Dependencies are inferred from the claim text.