# US 2012/0055799 A1 · Anisotropically conductive member and method of manufacture

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- Number: US 2012/0055799 A1
- Document ID: US20120055799A1
- Status: Published application
- Kind: A1
- Application number: 13/295,871
- Filed: 2011-11-14
- Published: 2012-03-08
- Earliest claimed: 2007-03-27
- Assignees: FUJIFILM Corporation
- Inventors: Yoshinori HOTTA; Takashi TOUMA; Yusuke HATANAKA
- Web page: https://patentgrep.com/patent/US20120055799A1

## CPC

- H10W 70/635: {Through-vias}
- G01R 1/06755: {Material aspects}
- H05K 3/4038: {Through-connections; Vertical interconnect access [VIA] connections (H05K3/403, H05K3/42 take precedence)}
- H10W 70/095: {of vias therein}
- G01R 1/07378: {using an intermediate adapter, e.g. space transformers (G01R1/07371 takes precedence)}
- H05K 2201/0116: Porous, e.g. foam
- H05K 2203/0315: Oxidising metal
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- G01R: MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES (indicating correct tuning of resonant circuits H03J3/12)
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

An anisotropically conductive member has an insulating base material, and conductive paths composed of a conductive material which pass in a mutually insulated state through the insulating base material in a thickness direction thereof and which are provided in such a way that a first end of each conductive path is exposed on a first side of the insulating base material and a second end of each conductive path is exposed on a second side of the insulating base material. The conductive paths have a density of at least 2 million paths/mm2 and the insulating base material is a structure composed of an anodized aluminum film having micropores therein.

## Claims

### Claim 1 (depends on 1)

A method of manufacturing the anisotropically conductive member of claim 1, comprising, in order:
an anodizing step of anodizing an aluminum substrate so as to form said anodized film having micropores therein;
a perforating step of passing holes determined by the micropores through the anodized film so as to obtain said insulating base material; and
a metal filling step of filling a metal as the conductive material into the holes which pass through the insulating base material so as to obtain said anisotropically conductive member.

### Claim 2 (depends on 1)

The method of claim 1, further comprising, after the metal filling step, a surface planarizing step of planarizing a front side and a back side of the anisotropically conductive member by chemical mechanical polishing.

### Claim 3 (depends on 1)

The method of claim 1, further comprising, after the metal filling step, a step of trimming the insulating base material on the surface of the anisotropically conductive member.

### Claim 4 (depends on 1)

The method of claim 1,
wherein the anodizing step including anodizing treatment, film removal treatment and re-anodizing treatment in this order, and
wherein the film removal treatment dissolves an anodized film formed by the anodizing treatment.

### Claim 5 (depends on 1)

The method of claim 1,
wherein the anodizing step including anodizing treatment and anodized film dissolution treatment in this order, the anodizing step being repeated at least twice,
wherein the anodized film dissolution treatment is pore widening treatment in which diameters of micropores present in an anodized film formed by the anodizing treatment, and
wherein the latest anodized film dissolution treatment dissolves interiors of the micropores on a surface side from a point of inflection of the anodized film.