Electronic component package sealing member, electronic component package, and method for producing the electronic component package sealing member
AssigneeDaishinku Corporation
InventorNaoki KOHDA
Life of this patent
Estimating the term…
Abstract
An electronic component package includes a first sealing member and a second sealing member. The first sealing member has one principal surface on which an electronic component element is to be mounted. The second sealing member is opposite the first sealing member. The second sealing member hermetically encloses an electrode of the electronic component element. A through hole passes through between one principal surface and another principal surface of a substrate constituting the first sealing member. A conducting material fills the through hole. A resin material seals an open end portion of the through hole at a side of the other principal surface of the substrate.
Claims7
An electronic component package sealing member that can be used as a first sealing member of an electronic component package which comprises:
- the first sealing member having one principal surface on which an electronic component element is to be mounted;
- and a second sealing member opposite the first sealing member, the second sealing member hermetically enclosing an electrode of the electronic component element,
- the electronic component package sealing member comprising:
- a substrate constituting the electronic component package sealing member, the substrate comprising at least one through hole passing through between one principal surface and another principal surface of the substrate;
- a conducting material in the at least one through hole;
- and
- a resin material sealing an open end portion of the at least one through hole at a side of the other principal surface of the substrate.
A method for producing an electronic component package sealing member that can be used as a first sealing member of an electronic component package which comprises:
- the first sealing member having one principal surface on which an electronic component element is to be mounted;
- and a second sealing member opposite the first sealing member, the second sealing member hermetically enclosing an electrode of the electronic component element,
- the method comprising:
- forming at least one through hole passing through between one principal surface and another principal surface of a substrate constituting the electronic component package sealing member;
- filling the at least one through hole with a conducting material;
- and
- sealing with a resin material an open end portion of the at least one through hole at a side of the other principal surface of the substrate.
Dependencies are inferred from the claim text.