Joined Structure and Method for Producing the Same

A method for producing a joined structure, comprising:

• after placing an anisotropic conductive film on a first electrode region formed on a substrate having a chamfer part at an edge thereof so that one edge of the anisotropic conductive film protrudes from the inner edge of the chamfer part of the substrate towards the outer side of the substrate, or the one edge of the anisotropic conductive film meets the inner edge of the cha infer part of the substrate, placing a wiring member containing a wiring plate formed thereon, where the wiring plate has a resist region in which the wiring plate is covered with a resist layer, and a second electrode region in which the wiring plate is not covered with the resist layer, so that the edge of the resist region at a boundary with the second electrode region comes above the chamfer part of the substrate;
• and
• heating and compressing the anisotropic conductive film from the side of the wiring member to melt and make the anisotropic conductive film flow into the side of the resist region to thereby cover the second electrode region with the anisotropic conductive film, so as to electrically connect the first electrode region and the second electrode region,
• wherein the substrate and the wiring member are joined together with the anisotropic conductive film to form the joined structure.