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US 2012/0055702 A1Published application
Compliant printed flexible circuit
AssigneeHsio Technologies, LLC
InventorJames Rathburn
Life of this patent
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Abstract
A compliant printed flexible circuit including a flexible polymeric film and at least one dielectric layer bonded to the polymeric film with recesses corresponding to a target circuit geometry. A conductive material is printed in at least a portion of the recesses to form a circuit geometry. At least one dielectric covering layer is printed over at least the circuit geometry. Openings can be printed in the dielectric covering layer to provide access to at least a portion of the circuit geometry.
Claims41
1-40. (canceled)
A compliant printed flexible circuit comprising:
- a flexible polymeric film;
- at least one dielectric layer selectively printed on the polymeric film with recesses corresponding to a target circuit geometry;
- a conductive material printed in at least a portion of the recesses comprising a circuit geometry;
- at least one dielectric covering layer printed over the conductive material;
- and
- at least one opening in the dielectric covering layer providing access to at least a portion of the circuit geometry.
3 more elements
A method of making a compliant printed flexible circuit comprising:
- selectively printing at least one dielectric layer to a flexible polymeric film to create recesses corresponding to a target circuit geometry;
- printing a conductive material in at least a portion of the recesses comprising a circuit geometry;
- and
- printing at least one dielectric covering layer over at least the circuit geometry.
1 more element
Dependencies are inferred from the claim text.