High performance surface mount electrical interconnect

An interconnect assembly comprising:

• a substrate comprising a plurality of through holes extending from a first surface to a second surface;
• a plurality of recesses in the second surface of the substrate that at least partially overlap with the plurality of through holes, the recesses comprise a cross-sectional area greater than a cross-sectional area of the through holes;
• a plurality of discrete contact members located in the plurality of the through holes, the plurality of contact members each comprising a proximal end accessible from the second surface, a distal end extending above the first surface, and an intermediate portion engaged with an engagement region of the substrate located between the first surface and the second surface;
• and
• retention members at least partially located in the recesses and bonded to proximal ends of the contact members to retain the contact members in the through holes.

An electrical interconnect assembly for electrically interconnecting terminals on a first circuit member with terminals on a second circuit member, the electrical interconnect assembly comprising:

• a substrate having a plurality of through holes extending from a first surface to a second surface and a plurality of recesses in the second surface of the substrate that at least partially overlap with the plurality of through holes, each recess having a cross-sectional area greater than a cross-sectional area of a corresponding overlapping through hole;
• a plurality of contact members located in the plurality of through holes, each of the plurality of contact members comprising a proximal end extending at least partially into one of the plurality of recesses in the second surface, a distal end extending above the first surface and adapted to electrically couple with a terminal on the first circuit member, and an intermediate portion engaged with an engagement region of the substrate located between the first surface and the one of the plurality of recesses;
• and
• a plurality of electrically conductive retention members at least partially located in the recesses and bonded the proximal ends of the contact members.

A method of forming an interconnect assembly comprising:

• forming a substrate with a plurality of through holes extending from a first surface to a second surface;
• forming a plurality of recesses in the second surface of the substrate that at least partially overlap with the plurality of through holes, the recesses comprise a cross-sectional area greater than a cross-sectional area of the through holes;
• inserting a plurality of discrete contact members in the plurality of through holes, the contact members comprising proximal ends accessible from the second surface, distal ends extending above the first surface, and intermediate portions engaged with an engagement region of the substrate located between the first surface and the recesses;
• depositing retention members at least partially in the recesses;
• and
• bonding the retention members to the proximal ends to retain the contact members in the through holes.