Double-sided pressure-sensitive adhesive tape for fixing flexible printed circuit board and flexible printed circuit board with the same

A double-sided pressure-sensitive adhesive tape for fixing a flexible printed circuit board, having a 180° peel adhesion, as determined by bonding the adhesive tape onto a stainless steel plate under pressure by one reciprocation of a 10-g roller, leaving it still for 5 minutes and measuring it at a tensile speed of 300 mm/minute, of 6.5 N/20 mm or more and a terminal separation distance after reflow described below of 2.5 mm or less.

• [Terminal Separation Distance after Reflow]
• the height of the terminal of a test sample separated from the surface of a polyimide plate, when a test sample having a double-sided pressure-sensitive adhesive tape carrying an aluminum plate having a thickness of 0.5 mm, a width of 10 mm, and a length of 90 mm bonded to one adhesive face thereof, is heated under the following heat treatment condition in reflow step, the test sample is then bent in the arc shape in the lengthwise direction of the test sample along a cylinder having a diameter of 30 mm with the aluminum plate facing inward, and the other adhesive face of the double-sided pressure-sensitive adhesive tape is bonded under pressure to the polyimide plate by a roll laminator under the condition of 23° C. and 0.3 m/minute and then left, as it is, under the condition of 23° C. and 50% RH for 24 hours and heated additionally at 70° C. for 2 hours.
• [Heat Treatment Condition in Reflow Step]
• (1) the surface temperature of the test sample reaches 175±10° C., in the period of 130 to 180 seconds after supply of the test sample to the reflow step (2) the surface temperature of the test sample reaches 230±10° C., in the period of 200 to 250 seconds after supply of the test sample to the reflow step
• (3) the surface temperature of the test sample reaches 255±15° C., in the period of 260 to 300 seconds after supply of the test sample to the reflow step
• (4) the reflow step is completed within 370 seconds after supply of the test sample to the reflow step.