System for clamping heat sink
AssigneeHarman International Industries, Incorporated
InventorGreg Mlotkowski
Life of this patent
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Abstract
A system for clamping a heat sink that prevents excessive clamping force is provided. The system may include a heat sink, a semiconductor device, a printed circuit board, and a cover. The semiconductor device may be mounted onto the circuit board and attached to the cover. The heat sink may be designed to interface with the semiconductor device to transfer heat away from the semiconductor device and dissipate the heat into the environment. Accordingly, the heat sink may be clamped into a tight mechanical connection with the semiconductor device to minimize thermal resistance between the semiconductor device and the heat sink. To prevent excessive clamping force from damaging the semiconductor device, loading columns may extend between the cover and the heat sink.
Claims36
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A cover comprising a planar surface and at least one column that extends substantially perpendicular to the planar surface, the at least one column being configured to extend a determined distance so that a heat sink coupleable to the cover in parallel with the planar surface is maintained at the determined distance away from the cover.
Dependencies are inferred from the claim text.