Split wave compensation for open stubs

A method comprising:

• providing a circuit substrate having a first surface and a second surface;
• forming a first via through said circuit substrate, said first via having a first end near said first surface and a second end near said second surface;
• forming a second via through said circuit substrate, said second via having a first end near said first surface and a second end near said second surface;
• providing a first conductive element;
• providing a second conductive element;
• electrically coupling said first end of said first via to said first end of said second via using said first conductive element;
• electrically coupling said second end of said first via to said second end of said second via using said second conductive element;
• providing an input node to said first via;
• and
• providing an output node to said second via.

A method comprising:

• providing a circuit substrate having a first surface and a second surface;
• forming a first via through said circuit substrate, said first via having a first end near said first surface and a second end near said second surface;
• forming a second via through said circuit substrate, said second via having a first end near said first surface and a second end near said second surface;
• providing a first conductive element;
• providing a second conductive element;
• electrically coupling said first end of said first via to said first end of said second via using said first conductive element;
• electrically coupling said second end of said first via to said second end of said second via using said second conductive element;
• providing an input node to said first via;
• providing an output node to said second via, wherein said input node and said output node are electrically coupled by a first conductive path through said first conducitive element and wherein said input node and said output node are electrically coupled by a second conductive path through said second conductive element;
• conducting a first portion of a signal between said input node and said output node through said first conductive path;
• and
• conducting a second portion of said signal between said input node and said output node through said second conductive path, wherein the first conductive path has substantially the same delay as said second conductive path.

A method comprising:

• providing a circuit substrate having a first surface and a second surface;
• forming a first via through said circuit substrate, said first via having a first end near said first surface and a second end near said second surface;
• forming a second via through said circuit substrate, said second via having a first end near said first surface and a second end near said second surface, and wherein said first via has a characteristic impedance substantially equal to the characteristic impedance of said second via;
• providing a first conductive element;
• providing a second conductive element;
• electrically coupling said first end of said first via to said first end of said second via using said first conductive element;
• electrically coupling said second end of said first via to said second end of said second via using said second conductive element;
• providing an input node to said first via;
• providing an output node to said second via, wherein said input node and said output node are electrically coupled by a first conductive path through said first conducitive element and wherein said input node and said output node are electrically coupled by a second conductive path through said second conductive element;
• conducting a first portion of a signal between said input node and said output node through said first conductive path;
• and
• conducting a second portion of said signal between said input node and said output node through said second conductive path.