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US 2012/0052311 A1Published application
Methods of bonding and articles formed thereby
AssigneeCorning Incorporated
InventorScott Mathew Bennett
Life of this patent
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Abstract
A method of bonding a polymer film to a mating part, including: placing a mating part in a nest; contacting the polymer film and the mating part; heating a die including a thermally conductive silicone to a temperature at or above a glass transition temperature of the polymer film, the mating part, or both; actuating the die onto the polymer film, wherein the thermally conductive silicone contacts the polymer film and bonds the polymer film to the mating part to form a bonded article; and actuating the die away from the polymer film.
Claims21
A method of bonding a polymer film to a mating part, comprising:
- placing a mating part in a nest;
- contacting the polymer film and the mating part;
- heating a die comprising a thermally conductive silicone to a temperature at or above a glass transition temperature of the polymer film, the mating part, or both;
- actuating the die onto the polymer film, wherein the thermally conductive silicone contacts the polymer film and bonds the polymer film to the mating part to form a bonded article;
- and
- actuating the die away from the polymer film.
3 more elements
An article comprising:
- a mating part comprising a first material;
- a polymer film comprising a second material, the film having a first surface and an opposing second surface;
- a bond that attaches the first surface of the polymer film to the mating part;
- and
- a bond region comprising the bond and residual silicone on the second surface of the polymer film.
2 more elements
Dependencies are inferred from the claim text.