Selective cure of adhesive in modular assemblies

A system, comprising:

• a module fixture supporting a plurality of battery cells, said module fixture defining a plurality of bonding wells with each bonding well accepting a first portion of one or more of said battery cells with said module fixture including one or more apertures communicated with one or more of said bonding wells with said bonding wells having a nominal depth;
• and
• a dispensing system, coupled to said module fixture, for dispensing an adhesive into each said bonding well and surrounding said first portions of each said battery cell, said adhesive being selectively curable upon application of a curing modality, wherein said dispensed adhesive includes a plurality of wettability characteristics during dispensing with said first portion of said adhesive having a different wettability than said second portion;
• and
• a curing structure for selectively exposing said adhesive to said curing modality in a multistep curing prosess, a first curing step exposing said first portion of said adhesive emerging from said apertures and not exposing said second portion to said curing modality as said first portion of said adhesive emerges from said apertures during dispensation of said adhesive into said plurality of bonding wells and a second curing step exposing said second portion of said adhesive after said first curing step.

A bonding method, the method comprising the steps of:

• (a) dispensing a high-wettability adhesive into a first module fixture populated with a plurality of elements wherein said first module fixture provides a plurality of bonding wells with each bonding well accepting a first portion of one or more of said elements with said module fixture including one more apertures communicated with one or more of said bonding wells, said adhesive being selectively curable upon application of a curing modality;
• (b) applying said curing modality selectively to a first portion of said dispensed adhesive in a seal zone, said seal zone including one or more regions surrounding said apertures wherein said dispensed adhesive in said seal zone is sufficiently cured to inhibit significant quantities of said adhesive from emerging from said apertures while said adhesive continues to be dispensed into said module fixture wherein said curing modality is not applied to a second portion of said adhesive outside of said seal zone;
• and
• (c) applying said curing modality to said second portion of said dispensed adhesive;
• and
• wherein said module fixture includes a first battery fixture clamshell and a second battery fixture clamshell, and said plurality of elements include a plurality of battery cells;
• and
• wherein said dispensed adhesive includes a plurality of wettability characteristics during dispensing with said first portion of said adhesive having a different wettability than said second portion of said adhesive.