Ultra Low Formaldehyde Binders for Nonwoven Substrates
AssigneeWacker Chemical Corporation
InventorsJohn Richard Boylan, Conrad William Perry
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Abstract
A low-formaldehyde binder composition for increasing wet and dry tensile strength of a nonwoven substrate includes: a) an aqueous vinyl acetate ethylene copolymer dispersion employing a nonionic, cationic or amphoteric dispersion stabilizer, b) chitosan, and c) one or more surfactants not including the dispersion stabilizer. The binder composition has a free formaldehyde content no greater than 10 ppm, at least 90 wt % of the one or more surfactants are nonionic, cationic, amphoteric or a combination of these, and the copolymer in the dispersion is free of formaldehyde-generating moieties.
Claims19
A low-formaldehyde binder composition for increasing wet and dry tensile strength of a nonwoven substrate, wherein the composition comprises
- a) an aqueous vinyl acetate ethylene copolymer dispersion employing a nonionic, cationic or amphoteric dispersion stabilizer,
- b) chitosan, and
- c) one or more surfactants not including the dispersion stabilizer;
- wherein the binder composition has a free formaldehyde content no greater than 10 ppm, at least 90 wt % of the one or more surfactants are nonionic, cationic, amphoteric or a combination of these, and the copolymer in the dispersion is free of formaldehyde-generating moieties.
Dependencies are inferred from the claim text.