Composition for thermosetting silicone resin
AssigneeNitto Denko Corporation
InventorsHiroyuki KATAYAMA, Takashi KONDO, Hirokazu MATSUDA, Ryuichi KIMURA
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Abstract
The present invention relates to a composition for a thermosetting silicone resin, including: (1) an organopolysiloxane having a silanol group at an end thereof; (2) an alkenyl group-containing silicon compound; (3) an epoxy group-containing silicon compound; (4) an organohydrogensiloxane; (5) a condensation catalyst; (6) a hydrosilylation catalyst; and (7) a silica particle, in which the (7) silica particle has a 50% volume cumulative diameter of from 2 to 50 μm, a content of particles having a particle size of 1 μm or less of 15% by number or less and a content of particles having a particle size of 60 μm or more of 15% by number or less.
Claims10
A composition for a thermosetting silicone resin, comprising:
- (1) an organopolysiloxane having a silanol group at an end thereof;
- (2) an alkenyl group-containing silicon compound;
- (3) an epoxy group-containing silicon compound;
- (4) an organohydrogensiloxane;
- (5) a condensation catalyst;
- (6) a hydrosilylation catalyst;
- and
- (7) a silica particle,
- wherein the (7) silica particle has a 50% volume cumulative diameter of from 2 to 50 μm, a content of particles having a particle size of 1 μm or less of 15% by number or less and a content of particles having a particle size of 60 μm or more of 15% by number or less.
Dependencies are inferred from the claim text.