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AssigneeApplied Materials, Inc.
InventorsDavid H. Mai, Stephen Jew, Xiaoyuan (Sandra) Hu
Estimating the term…
An apparatus and method for simulating a substrate being polished in a multiple carrier head per platen station when no substrate is provided in one or more of the multiple carrier heads is described. In one embodiment, a method for processing a substrate includes providing a single substrate to a polishing station adapted to process a plurality of substrates on a single polishing pad using at least a first carrier head and a second carrier head, retaining the single substrate in the first carrier head while the second carrier head remains substrate-free, urging the first carrier head and the second carrier head toward a polishing surface of the polishing pad; and providing relative movement between the polishing pad and the first carrier head.
A method for tuning a polishing process on a substrate in a processing station having at least a first carrier head and a second carrier head adapted to retain and process a substrate using a common polishing pad, the method comprising:
A method for tuning a polishing process on at least a first substrate in a polishing station adapted to process at least one substrate greater than the first substrate on a common polishing pad, the method comprising:
A method for processing a substrate, comprising:
Dependencies are inferred from the claim text.