Method for manufacturing wiring board
AssigneeIbiden Co., Ltd.
InventorsToru NAKAI, Tetsuo Amano, Atsushi Kamano, Yoshinori Takasaki
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Abstract
A method for manufacturing a wiring board includes forming a conductive pattern on an insulation layer, forming on the conductive pattern a resin insulation layer containing a resin and a silica-type filler, and irradiating a laser beam having an absorption rate with respect to the conductive pattern is in an approximate range of 30˜60% such that an opening portion reaching the conductive pattern is formed through the resin insulation layer. The silica-type filler in the resin insulation layer is in an amount of approximately 2˜60 wt. %.
Claims14
A method for manufacturing a wiring board, comprising:
- forming a conductive pattern on an insulation layer;
- forming on the conductive pattern a resin insulation layer comprising a resin and a silica-type filler, the silica-type filler in the resin insulation layer being in an amount of approximately 2˜60 wt. %;
- and
- irradiating a laser beam having an absorption rate with respect to the conductive pattern is in an approximate range of 30˜60% such that an opening portion reaching the conductive pattern is formed through the resin insulation layer.
Dependencies are inferred from the claim text.