Camera Module with Premolded Lens Housing and Method of Manufacture

A method for manufacturing a camera module comprising:

• providing an image capture device;
• providing a pre-fabricated circuit substrate;
• forming a lens housing on said pre-fabricated circuit substrate;
• and
• mounting said image capture device on said circuit substrate after said lens housing is formed on said circuit substrate;
• and wherein
• said step of forming said lens housing on said circuit substrate includes forming said lens housing on a first surface of said circuit substrate;
• and
• said step of mounting said image capture device on said circuit substrate includes mounting said image capture device on a second surface of said circuit substrate opposite said first surface of said circuit substrate.

A method for manufacturing a plurality of camera modules comprising:

• providing a pre-fabricated circuit substrate including a plurality of individual camera module circuit boards;
• forming a plurality of housings on said pre-fabricated circuit substrate, each of said housings being formed on an associated one of said individual camera module circuit boards;
• providing a plurality of image capture devices;
• and
• mounting said plurality of image capture devices on respective ones of said individual camera module circuit boards after said housings are formed on said associated individual camera module circuit boards;
• and wherein
• said step of forming said plurality of housings on said circuit substrate includes forming said housings on a first surface of said circuit substrate;
• and
• said step of mounting said image capture devices onto respective ones of said individual camera module circuit boards includes mounting said image capture devices on a second surface of said circuit substrate opposite said first surface of said circuit substrate.

A camera module workpiece comprising:

• a pre-fabricated circuit substrate including a plurality of individual camera module circuit boards;
• a plurality of lens housings formed on said circuit substrate, each of said lens housings being formed on an associated one of said individual camera module circuit boards;
• and
• a plurality of image capture devices mounted on said circuit substrate, each of said image capture devices being mounted on a respective one of said individual camera module circuit boards;
• and wherein
• said plurality of lens housings allows said plurality of image capture devices to be mounted on said circuit substrate after said plurality of lens housings is formed on said circuit substrate;
• and
• said plurality of lens housings is formed on a first surface of said circuit substrate and said plurality of image capture devices is mounted on a second surface of said circuit substrate opposite said first surface.