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US 2011/0299288 A1Published application
Solder and Lead Free Electronic Circuit and Method of Manufacturing Same
OwnerCarmen Rapisardainventor
Life of this patent
Estimating the term…
Abstract
An electronic circuit contains a circuit board with conducting tracks to which one or more electronic components with conducting contacts are positioned overlying portions of the conducting tracks and each such electronic component is held in place by a clamp that covers and is contact with the top surface of the electronic components so as to hold their conducting contacts in electrical contact with the conducting tracks of the circuit board. The clamp can include a resilient layer held between the top surface of electronic components and a rigid clamping sheet.
Claims13
An electronic circuit, comprising:
- a circuit board having conducting tracks;
- at least one electronic component having a top surface, a bottom surface and conducting contacts positioned overlying portions of the conducting tracks;
- a clamp that covers and is contact with the top surface and applies a force to the top surface of the at least one electronic component to hold the conducting contacts in electrical contact with the conducting tracks;
- and
- at least one lead wire that forms a first electrical contact between at least one conducting track of the circuit board and a first electrical component, said lead wire being held in place through a mechanical fit in the absence of any solder;
- wherein the conducting tracks are in electrical contact with the bottom surface of the component and electrical contact between the conducting tracks and the bottom surface is maintained in the absence of any solder;
- and
- wherein the clamp is comprised of a rigid clamping sheet and at least one fastener that secures the clamping sheet to the circuit board.
5 more elements
An electronic circuit, comprising:
- a circuit board having conducting tracks;
- an optical component having a top surface, a bottom surface and conducting contacts positioned overlying portions of the conducting tracks;
- and
- a clamp that covers and is in contact with the top surface and applies a force to the top surface of the optical component to hold the conducting contacts in electrical contact with the conducting tracks;
- and
- wherein the conducting tracks are in electrical contact with the bottom surface of the component and electrical contact between the conducting tracks and the bottom surface is maintained in the absence of any solder;
- and
- wherein the clamp is comprised of an optically transparent rigid clamping sheet and at least one fastener that secures the clamping sheet to the circuit board.
5 more elements
Dependencies are inferred from the claim text.