Packaging for a millimeter wave radio-frequency integrated circuit (rfic)
AssigneeSiklu Communication Ltd.
InventorsYigal Leiba, Elad Dayan
Life of this patent
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Abstract
Millimeter wave radio-frequency integrated circuit device comprises a housing and a millimeter wave radio frequency integrated circuit, the housing comprising a plurality of layers laminated together and two cavities defined by apertures within the layers which are positioned to correspond as the layers are laminated together. The radio frequency integrated circuit is located within the first cavity, and the second cavity serves as a radiating cavity. The RFIC is bonded to a transmission line which connects to the radiating cavity.
Claims24
Millimeter wave radio-frequency integrated circuit device, comprising
- a housing and a radio frequency integrated circuit;
- the housing comprising a plurality of layers laminated together and a first cavity defined within said laminated layers, the radio frequency integrated circuit being located within said first cavity.
A method of manufacturing a radio-frequency integrated circuit device, comprising:
- machining apertures into a series of laminate layers;
- laminating together said series of laminate layers such that said apertures form a first cavity;
- placing a radio frequency integrated circuit into said cavity;
- and
- sealing said cavity.
Housing for a millimeter wave radio-frequency integrated circuit device, comprising:
- a plurality of layers laminated together;
- and
- a first cavity defined within said laminated layers, said millimeter wave radio frequency integrated circuit being locatable within said first cavity.
Dependencies are inferred from the claim text.