Semiconductor device, method of manufacturing the same, electronic device, and electronic component
AssigneeFujitsu Limited
InventorsTeru NAKANISHI, Nobuyuki HAYASHI, Masaru MORITA, Yasuhiro YONEDA
Life of this patent
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Abstract
A semiconductor device includes: a wiring board including a first electrode pad on a surface thereof; a circuit board disposed to stand on the wiring board, and including an interconnection connected to the first electrode pad; and a semiconductor package disposed to face the wiring board with the circuit board interposed therebetween, and including a second electrode pad on a surface thereof, the second electrode pad being connected to the interconnection.
Claims20
A semiconductor device comprising:
- a wiring board including a first electrode pad on a surface thereof;
- a circuit board disposed to stand on the wiring board, and including an interconnection connected to the first electrode pad;
- and
- a semiconductor component disposed to face the wiring board with the circuit board interposed therebetween, and including a second electrode pad on a surface thereof, the second electrode pad being connected to the interconnection.
An electronic device comprising a semiconductor device mounted thereon, the semiconductor device comprising:
- a wiring board including a first electrode pad on a surface thereof;
- a circuit board disposed to stand on the wiring board, and including an interconnection connected to the first electrode pad;
- and
- a semiconductor component disposed to face the wiring board with the circuit board interposed therebetween, and including a second electrode pad on a surface thereof, the second electrode pad being connected to the interconnection.
An electronic component comprising:
- a wiring board including a first electrode pad on a surface thereof;
- and
- a circuit board disposed to stand on the wiring board, and including an interconnection for connecting the first electrode pad to a second electrode pad of a semiconductor element to be mounted on the wiring board.
A method of manufacturing a semiconductor device, the method comprising:
- standing a circuit board on a wiring board including a first electrode pad on a surface thereof;
- connecting the first electrode pad to an interconnection of the circuit board;
- mounting a semiconductor component on the circuit board in such a manner that the semiconductor component faces the wiring board with the circuit board interposed therebetween;
- and
- connecting the interconnection of the circuit board to a second electrode pad disposed on a surface of the semiconductor component.
Dependencies are inferred from the claim text.