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US 2011/0299069 A1Published application
Method of inspecting wafer
AssigneeSamsung Electronics Co., Ltd.
InventorsHwan-seok Jang, Jang-man Ko, Jun-seog Seong, Ho-bong Shin, Kil-su Lee, Chang-hun Lee
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Abstract
Wafer inspection method to perform wafer inspection based on photo map information. The wafer inspection method may include: detecting a sample center location on a wafer; compensating the detected sample center location to a compensated center location based on photo map information; and detecting defective dies included in the wafer based on the compensated center location.
Claims15
A wafer inspection method comprising:
- detecting a sample center location on a wafer;
- compensating the detected sample center location to a compensated center location based on photo map information;
- and
- detecting defect dies included in the wafer based on the compensated center location.
1 more element
11-21. (canceled)
A wafer inspection method comprising:
- compensating a sample center location of a wafer based on photo map information;
- and
- detecting defect dies included in the wafer based on the compensated center location.
Dependencies are inferred from the claim text.