Electrical interconnect using embossed contacts on a flex circuit

Abstract

A print head has a jet stack having an array of jets, an array of transducers arranged on the jet stack such that each transducer corresponds to a jet in the array of jets, and a flexible circuit substrate arranged adjacent the array of transducers such that contact pads on the flexible circuit substrate make electrical connection to at least some of the array of transducers, the flexible circuit substrate being embossed so that the contact pads extend out of a plane of the flexible circuit substrate. A method of manufacturing a print head includes forming a jet stack having an array of jets, arranging an array of transducers on the jet stack such that each transducer in the array of transducers corresponds to each jet in the array of jets, embossing a flexible circuit substrate having contact pads such that the contact pads extend out of a plane of the flexible circuit substrate, and arranging the flexible circuit substrate such that the contact pads electrically connect to at least some of the transducers in the array of transducers.

Dependencies are inferred from the claim text.