Component having a through-contact
AssigneeRobert Bosch GmbH
InventorJochen Reinmuth
Life of this patent
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Abstract
A method for manufacturing a component having a through-contact includes: providing a substrate; forming an insulating layer on the substrate; structuring the insulating layer, the insulating layer being removed at least in a predetermined trenching area surrounding a selected substrate area; performing an etching process in which the structured insulating layer functions as a mask to remove substrate material in the trenching area and to create a trench structure surrounding the selected substrate area; and forming a metallic layer on the insulating layer, the metallic layer sealing the trench structure.
Claims10
A method for manufacturing a component having a through-contact, comprising:
- providing a substrate;
- forming an insulating layer on the substrate;
- structuring the insulating layer by removing the insulating layer at least in a predetermined trenching area surrounding a selected substrate area;
- performing an etching process, wherein the structured insulating layer functions as a mask in the etching process, to remove substrate material in the trenching area and create a trench structure surrounding the selected substrate area;
- and
- forming a metallic layer on the insulating layer, wherein the metallic layer seals the trench structure.
A component, comprising:
- a substrate;
- a through-contact in the substrate, the through-contact including a selected substrate area and a trench structure surrounding the selected substrate area;
- a structured insulating layer situated on the substrate, wherein the structured insulating layer is removed at least in the area of the trench structure;
- and
- a metallic layer situated on the insulating layer, the metallic layer sealing the trench structure.
Dependencies are inferred from the claim text.