Stacked package
AssigneeSamsung Electronics Co., Ltd.
InventorYoung-Seok Hong
Life of this patent
Estimating the term…
Abstract
A stacked package for an electronic device and a method of manufacturing the stacked package include a first semiconductor package being formed with a first conductive pad and a second conductive pad. A second semiconductor package is formed with a third conductive pad and a fourth conductive pad and is disposed over the first semiconductor package. A first conductive connecting member electrically connects the first conductive pad and the third conductive pad. A second conductive connection member electrically connects the second conductive pad and the fourth conductive pad.
Claims14
A stacked package for an electronic device, the stacked package comprising:
- a first semiconductor package, the first semiconductor package having a first conductive pad and a second conductive pad;
- a second semiconductor package disposed over the first semiconductor package, the second semiconductor package having a third conductive pad and a fourth conductive pad;
- a first conductive connecting member configured to electrically connect the first conductive pad and the third conductive pad;
- and
- a second conductive connecting member configured to electrically connect the second conductive pad and the fourth conductive pad.
A stacked package for an electronic device, comprising:
- a first semiconductor package, the first semiconductor package comprising a first package substrate, the first package substrate comprising a first conductive pad and a second conductive pad;
- a second semiconductor package, the second semiconductor package comprising a second package substrate, the second package substrate comprising a third conductive pad and a fourth conductive pad, wherein the second semiconductor package is disposed over the first semiconductor package;
- a conductive ball electrically connecting the first conductive pad of the first package substrate and the third conductive pad of the second package substrate;
- and
- a conductive wire electrically connecting the second conductive pad of the first package substrate and the fourth conductive pad of the second package substrate.
14-20. (canceled)
Dependencies are inferred from the claim text.