Multi-chip package with pillar connection
AssigneeMosaid Technologies Incorporated
InventorRoland SCHUETZ
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Abstract
A semiconductor device has a substrate having a first plurality of substrate bonding pads disposed on a bonding surface thereof. A plurality of semiconductor dice is disposed on the substrate. Each die of the plurality of dice has a first plurality of die bonding pads arranged along at least one first edge thereof. A plurality of bonding pillars extends substantially vertically from the substrate bonding pads. Each bonding pillar electrically connects one of the first plurality of substrate bonding pads to a corresponding one of the first plurality of die bonding pads. A method of assembling a semiconductor device is also described.
Claims20
A semiconductor device, comprising:
- a substrate having a first plurality of substrate bonding pads disposed on a bonding surface thereof;
- a plurality of semiconductor dice disposed on the substrate, each die of the plurality of dice having a first plurality of die bonding pads arranged along at least one first edge thereof;
- and
- a plurality of bonding pillars extending substantially vertically from the substrate bonding pads, each bonding pillar electrically connecting one of the first plurality of substrate bonding pads to a corresponding one of the first plurality of die bonding pads.
A method of assembling a semiconductor device, comprising:
- forming a plurality of substantially vertical bonding pillars on a bonding surface of a substrate in electrical connection with a first plurality of substrate bonding pads;
- stacking a plurality of semiconductor dice on the bonding surface of the substrate, each of the plurality of dice having a first plurality of die bonding pads arranged along at least one first edge thereof, such that each of the first plurality of die bonding pads is in proximity of a corresponding one of the plurality of bonding pillars;
- and
- forming an electrical connection between each of the plurality of bonding pillars and the corresponding one of the first plurality of die bonding pads.
Dependencies are inferred from the claim text.